November 16-20, 2025

Pasadena, CA, USA

Join us for the 51st International Symposium for Testing and Failure Analysis (ISTFA) is set to take place in Pasadena, California, from November 16-20, 2025. As the premier event for the microelectronics failure analysis community, ISTFA brings together leading experts, industry professionals, and researchers to share insights, innovations, and methodologies in the field. This year’s theme, “Scaling Beyond Moore’s Law: Heterogeneous Computing and Advanced Packaging,” reflects the industry’s evolving landscape, where traditional scaling approaches are being challenged by the integration of diverse technologies and packaging strategies. Attendees will engage in a comprehensive program that includes keynote presentations, technical sessions, workshops, and networking opportunities, all designed to foster collaboration and knowledge exchange. Visit ibss at booth#611 to discuss how ibss products can help surmount contamination challenges in your failure analysis.